Since the first three electronics webinars received an overwhelming response Vision Engineering, a global manufacturer of innovative stereo and digital microscopes, will host a new 3 part series (presented by Bob Willis, a globally-recognised expert in surface mount and area array technology) covering:
Crimp Connector Inspection & Quality Control – Thursday, 15th September 2016
This webinar will cover the inspection of wire and crimp terminations, setting up of inspection standards, operator training and certification as well as the common process defects and corrective actions.
Printed Circuit Board Inspection & Quality Control – Wednesday, 12th October 2016
This webinar will cover PCB types, packaging for good solderability and identification of common problems that can lead to assembly issues and possible product failure.
Inspection of Conductive Adhesive Joints – Thursday, 10th November 2016
This webinar will cover the inspection conductive adhesive joints, inspection criteria, reliability of joints and common process defects and corrective actions.
The Electronics Academy Webinar Series will provide a better understanding of the PCB/SMT assembly, the challenges of achieving Zero Defect Manufacturing and aimed to provide attendees with a deep knowledge on how to identify quality issues, understand the common causes of solder joint failure. It is also a convenient and quick way to update current skills and attendees will have the opportunity to ask questions at the end of each webinar.
Vision Engineering is a preferred choice for innovative and ergonomic microscopes for the electronic industry and,offers customers high quality, innovative and ergonomically designed stereo and digital microscopes, and non-contact measuring systems.
Since 1958, Vision Engineering, with the patented Dynascope technology, helping hundreds of thousands of operators to overcome the ergonomic challenges faced with traditional binocular design such as eye fatigues and back strains.